Purdue University

Purdue’s new institute for advanced system integration and packaging honors Boilermaker and innovative visionary in semiconductors

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...
Purdue University

New institute accelerates future of microelectronic system integration, advanced packaging

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...
Electronic Design

Flexible Computing Design for Advanced System Development

How embedded technology is advancing military operations. Why open standards are crucial to today’s electronics systems. The importance of a unified infrastructure across critical communication ...
The Manila Times

ACM Research Ships First PECVD SiCN System for Advanced Semiconductor Applications

Proprietary three-station rotating deposition architecture enables demanding BEOL and advanced packaging processes ...
Reuters

Huawei shows off AI computing system to rival Nvidia's top product

SHANGHAI, July 26 (Reuters) - China's Huawei Technologies showed off an AI computing system on Saturday that one industry expert has said rivals Nvidia's most advanced offering, as the Chinese ...